Physicists at the University of Cambridge have used spintronics to move data between
layers of a 3D microchip (Image: Shutterstock)

Spintronics used to create 3D microchip

By Brian Dodson
February 1, 2013

A major obstruction to the development of practical 3D microchips is moving data and logic signals from one layer of circuitry to another. This can be done with conventional circuitry, but is quite cumbersome and generates a good deal of heat inside the 3D circuit. Physicists at the University of Cambridge have now developed a spintronic shift register that allows information to be passed between different layers of a 3D microchip.

Eventually, using current chip architecture, Moore’s law will run out of steam, as problems with lithography, materials, and cooling become more difficult to overcome. At some point in time, the development of truly three-dimensional circuitry (probably) grown on silicon will start to look like the simpler direction to follow for the next decade or two. If you can grow 100 layers of circuitry in an interconnected stack, not only have you provided about 15 years progress on Moore’s law, but you have also avoided some of the major bottlenecks facing stupendously large scale integration.

Read more: Spintronics used to create 3D microchip — gizmag.

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